Publication Type:

Conference Paper

Source:

SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland (2005)

Cite this Research Publication

V. T. Bui, Weir, R. D., Bonin, H. W., and Shantanu Bhowmik, “Adhesion and Durability of High Performance Polymer under Space and Radiation Environments (Invited Author)”, in SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland , 2005.