Publication Type:

Conference Paper

Source:

SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland (2005)

Cite this Research Publication

V. T. Bui, Weir, R. D., Bonin, H. W., and Shantanu Bhowmik, “Adhesion and Durability of High Performance Polymer under Space and Radiation Environments (Invited Author)”, in SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland , 2005.

207
PROGRAMS
OFFERED
5
AMRITA
CAMPUSES
15
CONSTITUENT
SCHOOLS
A
GRADE BY
NAAC, MHRD
8th
RANK(INDIA):
NIRF 2018
150+
INTERNATIONAL
PARTNERS