We have investigated metal gate electrodes for use with high k HfSiOx gate dielectric films using AVD® and ALD technology. First, we report on the characterization of the AVD® and ALD deposition techniques where both HfO2 and SiO2 are combined for the formation of HfSiOx. Nitrogen is then incorporated using both in-situ and ex-situ methods to form HfSiON and the resulting film properties are compared. Using an AVD process a work-function of >4.7eV for Ru and RuO2 gate electrode metals in combination with HfSiOx was obtained. A TaN-based metal gate was also characterized to target a promising pMOS solution using different compositions. Together with its high flexibility and composition control, both ALD and AVD® can become key processes for advanced high-k dielectrics as well as compatible CMOS metal electrodes.
Z. Karim, Biossiere, O., Lohe, C., Zhang, Z., Park, W., Manke, C., Baumann, P. K., Dalton, J., Dr. Sasangan Ramanathan, Lindner, J., and , “Advanced Metal Gate Electrode Options Compatible with ALD and AVD® HfSiOx-based Gate Dielectrics”, ECS Transactions, vol. 3, pp. 363–374, 2006.