Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.
Y. Shacham-Diamand, Osaka, T., Ohba, T., and Dr. Madhav Datta, Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. New York: Springer, 2009, p. XX, 552.