Atomic Layer Deposition (ALD) has successfully been applied to advanced microelectronic applications importantly for conformal coatings on high aspect ratio devices. However, traditional ALD is limited in deposition rate because the ability to bring precursors rapidly to the surface. In this paper we review recent results for precursor delivery using advanced vaporization (Trijet) as well as recent advances in Pulsed CVD (AVDÂ®) using art elements held in common with ALD technology. These and other advances - such as Multiple Single Wafer configurations allow ALD application for continued scaling under conditions of improved process control and higher productivity. Key applications include: capacitors (dielectrics and electrodes), transistors and contacts. This paper reviews these technological advances in the context of their applications.
Y. Senzaki, Seidel, T., McCormick, J., Kim, G. Y., Kim, H. Y., Karim, Z., Lu, B., Dr. Sasangan Ramanathan, Lindner, J., Silva, H., and Daulesberg, M., “Atomic Level Solutions for Advanced Microelectronic Applications”, in International Conference on Solid State and Integrated Circuit Technology, ICSICT 2008. , 2008.