Publication Type:

Conference Proceedings


International Conference on Solid State and Integrated Circuit Technology, ICSICT 2008. (2008)


advanced microelectronic applications, advanced vaporization, Art, atomic layer deposition, atomic level solutions, Capacitors, Chemical vapour deposition, coating techniques, Coatings, Dielectrics, Electrodes, Integrated circuits, Microelectronics, precursor delivery, Process control, Productivity, pulsed CVD, semiconductor process modelling, Transistors, Trijet


Atomic Layer Deposition (ALD) has successfully been applied to advanced microelectronic applications importantly for conformal coatings on high aspect ratio devices. However, traditional ALD is limited in deposition rate because the ability to bring precursors rapidly to the surface. In this paper we review recent results for precursor delivery using advanced vaporization (Trijet) as well as recent advances in Pulsed CVD (AVD®) using art elements held in common with ALD technology. These and other advances - such as Multiple Single Wafer configurations allow ALD application for continued scaling under conditions of improved process control and higher productivity. Key applications include: capacitors (dielectrics and electrodes), transistors and contacts. This paper reviews these technological advances in the context of their applications.

Cite this Research Publication

Y. Senzaki, Seidel, T., McCormick, J., Kim, G. Y., Kim, H. Y., Karim, Z., Lu, B., Dr. Sasangan Ramanathan, Lindner, J., Silva, H., and Daulesberg, M., “Atomic Level Solutions for Advanced Microelectronic Applications”, International Conference on Solid State and Integrated Circuit Technology, ICSICT 2008. . 2008.

It appears your Web browser is not configured to display PDF files. Download adobe Acrobat or click here to download the PDF file.