Publication Type:



Volume US7250678 B2, Number US 10/776,448 (2007)



The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.

Cite this Research Publication

M. Datta, Emory, D., Suh, D., Joshi, S. M., and Menezes, S., “Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same”, U.S. Patent US 10/776,4482007.