Publication Type:



Volume US6853076 B2, Number US 09/961,034 (2005)



The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.

Cite this Research Publication

M. Datta, Emory, D., Joshi, S. M., Menezes, S., and Suh, D., “Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same”, U.S. Patent US 09/961,0342005.