Publication Type:

Patent

Source:

Volume US6853076 B2, Number US 09/961,034 (2005)

URL:

https://www.google.com/patents/US6853076

Abstract:

The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.

Cite this Research Publication

Dr. Madhav Datta, Emory, D., Joshi, S. M., Menezes, S., and Suh, D., “Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same”, U.S. Patent US 09/961,0342005.

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