Publication Type:

Journal Article

Source:

Journal of the Electrochemical Society, The Electrochemical Society, Volume 143, Number 2, p.544–549 (1996)

URL:

http://jes.ecsdl.org/content/143/2/544.short

Keywords:

electrochemical machining, masks, metallic thin films, Micromachining, shape control

Abstract:

A mathematical model to predict shape evolution during through‐mask electrochemical micromachining (EMM) has been developed. Boundary element method has been used to solve the Laplace equation for electric potential with appropriate boundary conditions that describe the metal dissolution process under ohmic control. The influence of mask wall angle on shape of the evolving cavity, current distribution within the cavity and etch factor have been determined. For mask wall angles less than 90°, the etch factor increased due to the shadowing effect of the mask, whereas the etch factor decreased for mask wall angles greater than 90°. The influence of mask wall angle has been found to diminish with increasing metal film thickness.

Cite this Research Publication

R. V. Shenoy and Dr. Madhav Datta, “Effect of Mask Wall Angle on Shape Evolution during Through-Mask Electrochemical Micromachining”, Journal of the Electrochemical Society, vol. 143, pp. 544–549, 1996.

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