Publication Type:

Patent

Source:

Volume US5567300 A, Number US 08/300,623 (1996)

URL:

https://www.google.com/patents/US5567300

Abstract:

A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization.

Cite this Research Publication

Dr. Madhav Datta and O'Toole, T. R., “Electrochemical metal removal technique for planarization of surfaces”, U.S. Patent US 08/300,6231996.