Publication Type:

Book Chapter

Source:

Microelectronic Packaging, Datta, M., Osaka, T., Schultze, J.W., editors, US: CRC Press, Boca Raton, p.31 (2005)

ISBN:

9780203473689

URL:

http://www.crcnetbase.com/doi/abs/10.1201/9780203473689.pt2

Cite this Research Publication

V. Dubin, Simka, H. S., Shankar, S., Moon, P., Marieb, T., and Dr. Madhav Datta, “Electroplating process for cu chip metallization”, in Microelectronic Packaging, Datta, M., Osaka, T., Schultze, J.W., editors, Boca Raton: US: CRC Press, 2005, p. 31.