Mass transport during the electrodeposition of copper from acidified sulphate solution using single and multiple pulses was studied. Experimental results obtained in a diffusion cell and with a rotating hemispherical electrode are compared with published theoretical calculations of various degrees of mathematical sophistication and complexity. The simple duplex diffusion-layer model proposed by Ibl gives adequate values of the pulse limiting current density for many practical purposes. The agreement with experiment can be further improved by using a semi-empirical modification of the model.
Dr. Madhav Datta and Landolt, D., “Experimental investigation of mass transport in pulse plating”, Surface technology, vol. 25, pp. 97–110, 1985.