Publication Type:

Journal Article

Source:

Surface technology, Elsevier, Volume 25, Number 2, p.97–110 (1985)

URL:

http://www.sciencedirect.com/science/article/pii/0376458385900226

Abstract:

Mass transport during the electrodeposition of copper from acidified sulphate solution using single and multiple pulses was studied. Experimental results obtained in a diffusion cell and with a rotating hemispherical electrode are compared with published theoretical calculations of various degrees of mathematical sophistication and complexity. The simple duplex diffusion-layer model proposed by Ibl gives adequate values of the pulse limiting current density for many practical purposes. The agreement with experiment can be further improved by using a semi-empirical modification of the model.

Cite this Research Publication

Dr. Madhav Datta and Landolt, D., “Experimental investigation of mass transport in pulse plating”, Surface technology, vol. 25, pp. 97–110, 1985.

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