Publication Type:

Journal Article


Surface technology, Elsevier, Volume 25, Number 2, p.97–110 (1985)



Mass transport during the electrodeposition of copper from acidified sulphate solution using single and multiple pulses was studied. Experimental results obtained in a diffusion cell and with a rotating hemispherical electrode are compared with published theoretical calculations of various degrees of mathematical sophistication and complexity. The simple duplex diffusion-layer model proposed by Ibl gives adequate values of the pulse limiting current density for many practical purposes. The agreement with experiment can be further improved by using a semi-empirical modification of the model.

Cite this Research Publication

Dr. Madhav Datta and Landolt, D., “Experimental investigation of mass transport in pulse plating”, Surface technology, vol. 25, pp. 97–110, 1985.