Publication Type:



Volume US20110073292 A1, Number US 12/571,265 (2009)



The present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a small pressure drop across the system. The present invention teaches the use of wall features on the fins of a heat exchanger to cool fluid in a fluid cooling system. The present invention also discloses high aspect ratio, high surface area structures applicable in micro-heat exchangers for fluid cooling systems and cost effective methods for manufacturing the same.

Cite this Research Publication

Dr. Madhav Datta, Zhou, P., Choi, H. - W., Leong, B., McMaster, M., and Werner, D. E., “Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems”, U.S. Patent US 12/571,2652009.