Publication Type:

Journal Article

Source:

Intel Assembly and Test Technology Journal, p.247-258 (2000)

Cite this Research Publication

Dr. Madhav Datta, Atluri, V., Lee, K., Stevenson, K., Tadayon, P., Jones, M., and Berry, M., “Integration of Pb-free Flip-Chip Bumping Process”, Intel Assembly and Test Technology Journal, pp. 247-258, 2000.

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