Publication Type:



Volume US6696758 B2, Number US 10/290,776 (2004)



An apparatus including a substrate comprising a device having contact point; a dielectric layer overlying the device with an opening to the contact point; and an interconnect structure disposed in the opening including an interconnect material and a different conductive shunt material.

Cite this Research Publication

V. M. Dubin, Thomas, C. D., McGregor, P., and Datta, M., “Interconnect structures and a method of electroless introduction of interconnect structures”, U.S. Patent US 10/290,7762004.