Publication Type:

Patent

Source:

Volume US6696758 B2, Number US 10/290,776 (2004)

URL:

https://www.google.com/patents/US6696758

Abstract:

An apparatus including a substrate comprising a device having contact point; a dielectric layer overlying the device with an opening to the contact point; and an interconnect structure disposed in the opening including an interconnect material and a different conductive shunt material.

Cite this Research Publication

V. M. Dubin, Thomas, C. D., McGregor, P., and Dr. Madhav Datta, “Interconnect structures and a method of electroless introduction of interconnect structures”, U.S. Patent US 10/290,7762004.

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