Publication Type:

Journal Article

Source:

Applied Surface Science, Volume 252, Number 18, p.6323 - 6331 (2006)

URL:

http://www.sciencedirect.com/science/article/pii/S0169433205011839

Keywords:

Plasma-damage; Porous films; Low-k; Supercritical CO2

Abstract:

Hexamethyldisilazane (HMDS) vapor treatment of plasma-damaged nanoporous organosilicate thin films has been studied as a function of treatment temperature in this work. Although, the \{HMDS\} vapor treatment facilitated incorporation of methyl (CH3) groups subsequent to the removal of free hydroxyl (OH) groups in the damaged films at treatment temperature as low as 55 °C, the bonded \{OH\} groups were not removed. More significantly, detailed analysis of the results reveals that \{HMDS\} vapor modified only the surface of the plasma-damaged samples and not the entire film as expected. This is attributed to the formation of a thin solid layer on the surface, which effectively prevents penetration of \{HMDS\} vapors into the bulk. The Fourier transform-infrared (FT-IR) absorption and dielectric constant measurements confirm that the vapor treatment assists only partial curing of the plasma-damaged films. Alternative processes of curing the films with \{HMDS\} dissolved in supercritical carbon dioxide (SCCO2) as a medium of reaction in static and pulsed modes were also attempted and the results are presented in this paper.

Cite this Research Publication

Dr. T. Rajagopalan, Lahlouh, B., Lubguban, J. A., Biswas, N., Gangopadhyay, S., Sun, J., Huang, D. H., Simon, S. L., Toma, D., and Butler, R., “Investigation on hexamethyldisilazane vapor treatment of plasma-damaged nanoporous organosilicate films”, Applied Surface Science, vol. 252, pp. 6323 - 6331, 2006.

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