Localized, maskless electrodeposition of lead‐tin solder from a sulfonate electrolyte has been achieved by means of laser enhancement. Well defined spots and lines with good surface morphology have been deposited on copper and nickel substrates. This is possible because the laser is found to reduce the deposition overpotential on these substrates.
Q. Lin, Sheppard, K. G., Dr. Madhav Datta, and Romankiw, L. T., “Laser-Enhanced Electrodeposition of Lead-Tin Solder”, Journal of The Electrochemical Society, vol. 139, pp. L62–L63, 1992.