Publication Type:

Conference Paper


Procedia Engineering, Volume 30, Coimbatore, p.1163-1170 (2012)



CMOS, Communication, Deep sub-micron, Electric power supplies to apparatus, Leakage currents, Low power electronics, Power minimization, Printed circuit design, Sub-threshold leakage, Systems analysis, transistor stacking, VLSI circuits


The leakage power dissipation has become one of the most challenging issues in low power VLSI circuit designs especially with on-chip devices as it doubles for every two years[4]-[5]. The scaling down of threshold voltage has contributed enormously towards increase in subthreshold leakage current thereby making the static (leakage) power dissipation very high. According to International Technology Roadmap for Semiconductors (ITRS), the total power dissipation may be significantly contributed by leakage power dissipation [1]. The battery operated devices with long duration in standby mode may be drained out very quickly due to the leakage power. In CMOS submicron technologies, leakage power dissipation plays a significant role. However, various low power design techniques for efficient minimization of leakage power are proposed in the literature review. A comprehensive study and analysis of various leakage power minimization techniques have been presented in this paper. The present research study and its corresponding analysis are mainly focusing on circuit performance parameters. It is implied from the current literature that only an appropriate choice of leakage power minimization technique for a specific application can be effectively carried by a VLSI circuit designer based on sequential analytical approach.


cited By (since 1996)0; Conference of org.apache.xalan.xsltc.dom.DOMAdapter@54bd0180 ; Conference Date: org.apache.xalan.xsltc.dom.DOMAdapter@44ada5f6 Through org.apache.xalan.xsltc.dom.DOMAdapter@646adcb3; Conference Code:89225

Cite this Research Publication

M. Ga Priya, Baskaran, Kb, and Krishnaveni, Dc, “Leakage power reduction techniques in deep submicron technologies for VLSI applications”, in Procedia Engineering, Coimbatore, 2012, vol. 30, pp. 1163-1170.