Publication Type:

Patent

Source:

Volume US5796168 A, Number US 08/711,433 (1998)

URL:

https://www.google.com/patents/US5796168

Abstract:

Reduced undercutting of a titanium-tungsten layer in a ball limiting metallurgy (BLM) is achieved in the preparation of solder ball interconnect structures by removing metal oxide film which forms on the titanium-tungsten layer and etching the titanium-tungsten layer in different steps. Removing the metal oxide with an acid solution prior to etching the titanium-tungsten layer provides for a more uniform etch of the titanium-tungsten layer.

Cite this Research Publication

Dr. Madhav Datta, Kanarsky, T. Safron, Pike, M. Barry, and Shenoy, R. Vaman, “Metallic interconnect pad, and integrated circuit structure using same, with reduced undercut”, U.S. Patent US 08/711,4331998.

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