Publication Type:

Patent

Source:

Volume US5620611 A, Number US 08/659,459 (1997)

URL:

https://www.google.com/patents/US5620611

Abstract:

Reduced undercutting of a titanium-tungsten layer in a ball limiting metallurgy (BLM) is achieved in the preparation of solder ball interconnect structures by removing metal oxide film which forms on the titanium-tungsten layer and etching the titanium-tungsten layer in different steps. Removing the metal oxide with an acid solution prior to etching the titanium-tungsten layer provides for a more uniform etch of the titanium-tungsten layer.

Cite this Research Publication

Dr. Madhav Datta, Kanarsky, T. S., Pike, M. B., and Shenoy, R. V., “Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads”, U.S. Patent US 08/659,4591997.

207
PROGRAMS
OFFERED
5
AMRITA
CAMPUSES
15
CONSTITUENT
SCHOOLS
A
GRADE BY
NAAC, MHRD
9th
RANK(INDIA):
NIRF 2017
150+
INTERNATIONAL
PARTNERS
  • Amrita on Social Media

  • Contact us

    Amrita Vishwa Vidyapeetham
    Amritanagar, Coimbatore - 641 112
    Tamilnadu, India