Publication Type:



Volume US8254422 B2, Number US 12/536,361 (2012)



A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.

Cite this Research Publication

Dr. Madhav Datta, Leong, B., and McMaster, M., “Microheat exchanger for laser diode cooling”, U.S. Patent US 12/536,3612012.