Publication Type:



Number US 10/262,992, USA (2004)



A method to deposit a passivating layer of a first material on an interior reactor surface of a cold or warm wall reactor, in which the first material is non-reactive with one or more precursor used to form a second materials. Subsequently when a film layer is deposited on a substrate by subjecting the substrate to the one or more precursors, in which at least one precursor has a low vapor pressure, uniformity and repeatability is improved by the passivation layer.

Cite this Research Publication

A. R. Londergan, Ramanathan S., Winkler, J., and Seidel, T. E., “Passivation Method for Improved Uniformity and Repeatability for Atomic Layer Deposition and Chemical Vapor Deposition”, U.S. Patent US 10/262,9922004.