Publication Type:

Journal Article

Source:

International Journal of Adhesion and Adhesives, Volume 48, p.188 - 193 (2014)

URL:

http://www.sciencedirect.com/science/article/pii/S0143749613001693

Keywords:

bonding process optimization

Abstract:

<p>Abstract The use of adhesive bonding for high temperature applications is becoming more challenging because of low thermal and mechanical properties of commercially available adhesives. However, the development of high performance polymers can overcome the problem of using adhesive bonding at high temperature. Polybenzimidazole (PBI) is one such recently emerged high performance polymer with excellent thermal and mechanical properties. It has a tensile strength of 160 \{MPa\} and a glass transition of 425 °C. Currently, \{PBI\} is available in solution form with only 26% concentration in Dimethyl-acetamide solvent. Due to high solvent contents, the process optimization required lot of efforts to form \{PBI\} adhesive bonded joints with considerable lap shear strength. Therefore, in present work, efforts are devoted to optimize the adhesive bonding process of \{PBI\} in order to make its application possible as an adhesive for high temperature applications. Bonding process was optimized using different curing time and temperatures. Epoxy based carbon fiber composite bonded joints were successfully formed with single lap shear strength of 21 Mpa. \{PBI\} adhesive bonded joints were also formed after performing the atmospheric pressure plasma treatment of composite substrate. Plasma treatment has further improved the lap shear strength of bonded joints from 21 \{MPa\} to 30 MPa. Atmospheric pressure plasma treatment has also changed the mode of failure of composite bonded joints.</p>

Cite this Research Publication

H. M. S. Iqbal, Shantanu Bhowmik, and Benedictus, R., “Process optimization of solvent based polybenzimidazole adhesive for aerospace applications”, International Journal of Adhesion and Adhesives, vol. 48, pp. 188 - 193, 2014.

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