Publication Type:

Journal Article


ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, Volume 3, Denver, CO, p.745-750 (2011)





Coated systems, Coating-substrate, Creep, Creep-fatigue, Cyclic indentation, Deformation behavior, Displacement burst, Exhibitions, Finite element simulations, Indentation depth, Load displacements, Loading, Mechanical engineering, Nickel, Nickel thin film, Number of cycles, Plastic dissipation, Room temperature, Spheres, Spherical indentations, Stress concentration, Thin films, Yield strain


In this paper, finite element simulations of spherical indentation of Nickel thin film on Steel-4340 are studied for single and multiple cycle of indentation as well. The objective was to understand the mechanics of coated systems, from load-displacement (P-h) curves, stress distribution in the film and the effect of substrate yield strength on the indentation response. The loading portion of P-h curve showed displacement bursts and the reason for this is investigated. A transition in the deformation behavior of the film from Hertz-type to flexure was observed for a normalized indentation depth of h/tf≈0.2. The influence of coating-substrate properties on P-h curve is also investigated for different h/tf ratios and yield strains. Attempts are also made to explore the possibility of understanding the creep-fatigue behavior of coated specimen subjected to cyclic indentation at room temperature from Indentation depth v/s time, Indentation depth v/s number of cycles and Plastic dissipation energy v/s number of cycles curve.


cited By (since 1996)0; Conference of org.apache.xalan.xsltc.dom.DOMAdapter@110156ee ; Conference Date: org.apache.xalan.xsltc.dom.DOMAdapter@6ef22bfa Through org.apache.xalan.xsltc.dom.DOMAdapter@5d2562fd; Conference Code:93919

Cite this Research Publication

R. V. Prakash, Arunkumar, S., and Dr. Ajith Ramesh, “Spherical indentation of nickel thin film on steel - 4340 substrate”, ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, vol. 3, pp. 745-750, 2011.