The popularity of LED panel as a source of illumination has soared recently due to its high efficiency. However, the removal of heat that is produced in the chip is still a major challenge in its design since this has an adverse effect on its reliability. If high junction temperature develops, the colour of the emitted light may diminish over prolonged usage or even a colour shift may occur. In this paper, a solution has been developed to address this problem by using a combination of heat pipe and heat fin technology. A single-phase and a two-phase heat pipes have been designed theoretically and computational simulations carried out using ANSYS FLUENT. The results of the theoretical calculations and those obtained from the simulations are found to be in agreement with each other.
cited By 0; Conference of 1st International Conference on Materials, Alloys and Experimental Mechanics, ICMAEM 2017 ; Conference Date: 3 July 2017 Through 4 July 2017; Conference Code:130336
K. C. Vyshnave, Rohit, G., Maithreya, D. V. N. S., and Rakesh, S. G., “Studies on single-phase and multi-phase heat pipe for LED panel for efficient heat dissipation”, in IOP Conference Series: Materials Science and Engineering, 2017, vol. 225.