Publication Type:

Conference Paper

Source:

SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland (2005)

Cite this Research Publication

Shantanu Bhowmik, Weir, R. D., Bonin, H. W., and Bui, V. T., “Thermal Fatigue Behavior of Adhesive Bonding of Titanium for Aerospace Application (Invited Author)”, in SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland, 2005.

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