Publication Type:

Conference Paper

Source:

HAVE 2017 - IEEE International Symposium on Haptic, Audio-Visual Environments and Games, Proceedings, Institute of Electrical and Electronics Engineers Inc. (2017)

ISBN:

9781538609798

URL:

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85048767752&doi=10.1109%2fHAVE.2017.8240356&partnerID=40&md5=c3a71b1477595f8c32133ff5268d8efe

Keywords:

bimanual micro skill, Design and Development, Electronics industry, haptic interfaces, Mice (computer peripherals), Printed circuit boards, Simulators, Skill training, Soldering, Surface mount components, Surface mount device, Surface mount technology, Training Systems, User study, Vocational education

Abstract:

Given the wide skill gap prevalent in the developing nations today, providing vocational education to the unskilled promises to improve the quality of life of people. Vocational skills are practical competencies and the necessary underpinning knowledge that helps a person acquire gainful employment in the labor market. This paper focuses on a surface mount hand soldering technique which is a vocational skill that is needed in the electronics hardware industry. Surface mount hand soldering is a complex bimanual task that uses a tweezer tool and soldering iron for soldering a surface mount component on a printed circuit board. As this requires a lot of practice to master, our research aims to develop a haptic simulator to train the untrained on the required skills. In this paper we describe the design and development of a tweezer haptic interface for a soldering simulator. It also discusses the user studies and experiments that were helpful in deciding the specification of the device and the skill characterization of tools involved in surface mount soldering. © 2017 IEEE.

Cite this Research Publication

N. Amritha, Jose, J., Rahul, E. S., and Rao R. Bhavani, “A tweezer haptic interface for training surface mount device assembly”, in HAVE 2017 - IEEE International Symposium on Haptic, Audio-Visual Environments and Games, Proceedings, 2017.