Publication Type:

Patent

Source:

Volume US6703069 B1, Number US 10/262,281 (2004)

URL:

https://www.google.com/patents/US6703069

Abstract:

The present invention describes a method including providing a component, the component having a bond pad; forming a passivation layer over the component; forming a via in the passivation layer to uncover the bond pad; and forming an under bump metallurgy (UBM) over the passivation layer, in the via, and over the bond pad, in which the UBM includes an alloy of Aluminum and Magnesium.
The present invention also describes an under bump metallurgy (UBM) that includes a lower layer, the lower layer including an alloy of Aluminum and Magnesium; and an upper layer located over the lower layer.

Cite this Research Publication

P. K. Moon, Ma, Z., and Dr. Madhav Datta, “Under bump metallurgy for lead-tin bump over copper pad”, U.S. Patent US 10/262,2812004.

207
PROGRAMS
OFFERED
5
AMRITA
CAMPUSES
15
CONSTITUENT
SCHOOLS
A
GRADE BY
NAAC, MHRD
9th
RANK(INDIA):
NIRF 2017
150+
INTERNATIONAL
PARTNERS