Publication Type:



Volume US6703069 B1, Number US 10/262,281 (2004)



The present invention describes a method including providing a component, the component having a bond pad; forming a passivation layer over the component; forming a via in the passivation layer to uncover the bond pad; and forming an under bump metallurgy (UBM) over the passivation layer, in the via, and over the bond pad, in which the UBM includes an alloy of Aluminum and Magnesium.
The present invention also describes an under bump metallurgy (UBM) that includes a lower layer, the lower layer including an alloy of Aluminum and Magnesium; and an upper layer located over the lower layer.

Cite this Research Publication

P. K. Moon, Ma, Z., and Datta, M., “Under bump metallurgy for lead-tin bump over copper pad”, U.S. Patent US 10/262,2812004.