Electrodeposition is the process of cathodic deposition of metals, alloys, and other conducting materials from an electrolyte using an external potential (electric current) for the cation reduction process to occur at the working substrate. The deposition process is also known as electrolytic plating, electroplating, or simply plating. Electrodeposition is widely employed in a variety of applications ranging from coatings for wear and corrosion resistance to nanoscale feature fabrication for ultra-large-scale integration (ULSI). The deposition thickness may vary from few angstroms of uniformly deposited compact films to electroformed structures that are millimeters thick. Compared to competing vacuum deposition processes, electrodeposition has emerged as more environmentally friendly and cost-effective micro/nanofabrication method.
Dr. Madhav Datta, “Electrodeposition”, in Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, Shacham-Diamand, Y., Osaka, T., Datta, M., Ohba, T., editors, Springer, 2009, pp. 63–71.