PCB Design, Rules and Manufacturability – PCB Technology – Component Packaging; Layer Stackup, Via Technology, HDI Concept; PCB Materials; Thermal and Mechanical Properties; PCB Design – Influencing Factors; Final Concept of the Board – functionality, features and interconnection, placement in the final product and dimensions, Temperature Range, Identifying the kind of PCB required; Schematic – components required, values, rating, sizes, etc.; BoM; Functional Blocks; File format; Routing; Testing – ERC and DRC; Documentation; Power, Ground and Signal Trace considerations; Thermal Issues; Choice of CAD
Thermal Management for Electronics – Introduction; Heat Transfer Theory; Concept of thermal resistance; Use of datasheets; Passive and Active Cooling; Aspects of heat sink design; Heat management in Automotive and Biomedical applications; Examples
Textbooks / References:
- M. Scarpino, Designing circuit boards with EAGLE: make high-quality PCBs at low cost, Upper Saddle River, NJ: Prentice Hall, 2014.
- Wilson P, The circuit designer’s companion, 3rd ed. Oxford: Newnes, 2011.
- T. Y. Obidi, Ed., Thermal management in automotive applications, Warrendale, Pennsylvania, USA: SAE International, 2015.
- R. Remsburg, Thermal design of electronic equipment, Boca Raton, Fla.: CRC Press, 2001.