Introduction and preparation of thin film: Difference between thin and thick film. Appreciation of thin film technology in modern era. Deposition technology: Physical methods, chemical methods, other new techniques, vacuum technology: Vacuum pumps & pressure gauges.
Defects in thin film: General concepts, nature of defect, microscopic defect and dislocation. Boundary defects. Defect and energy states - donar acceptor levels, trap and recombination centers, excitons, phonons.
Thin film analysis: Structural studies: XRD and electron diffraction. Surface studies: electron microscopy studies on film (SEM, TEM, AFM) Film composition: X-ray photoelectron spectroscopy (XPS), Rutherford Back Scattering spectroscopy (RBS) and Secondary Ion Mass Spectroscopy (SIMS).
Properties of thin film: Optical behaviors: transmission, reflection, refractive index, photoconductivity, and photoluminescence.
Electrical behaviors: sheet resistivity, electron mobility and concentration, Hall effect, conduction in MIS structure.
Mechanical behaviors: stress, adhesion, hardness, stiffness.
Applications of thin films in various fields: Antireflection coating, FET, TFT, resistor, thermistor, capacitor, solar cell, and MEMs fabrication of silicon wafer: Introduction. preparation of the silicon wafer media, silicon wafer processing steps.