| Course Name | VLSI Fabrication Technology |
| Course Code | 15ECE371 |
| Program | B. Tech. in Electronics and Communication Engineering |
| Year Taught | 2019 |
Brief History of Semiconductor technology, Scaling Trends and Scaling Methodologies, Scaling Challenges, ITRS Roadmap; Starting material, silicon structure and properties, Czochralski and Float Zone crystal growth, GaAs growth; Silicon oxidation methods and properties, Deal Grove Model, Photolithography – masks, pattern transfer techniques, minimum resolvable feature sizes, UV sources, photoresists.
Diffusion and ion implantation, Types of diffusion, Ficks laws, junction depth, Stopping mechanisms, Gaussian implantation profile, variations to predicted distribution, implantation damage and annealing; Deposition requirements and techniques – Physical and Chemical Vapor deposition, Epitaxial growth techniques; Wet and dry etching techniques, Etch requirements, Chemical Mechanical Polishing;
Interconnect Technology – Copper and Aluminum interconnects, Silicodes, Isolation, CMOS and BJT Process flow; CMOS process for sub-100nm era – dielectrics and gate electrodes, Low K Dielectrics with Cu, Strained silicon, Silicon Germanium, Process Techniques to overcome Short Channel Effects, Nanolithography techniques, SOI Technology, Ultra Shallow Junction. Multiple Gate MOSFETs.
Stephen Campbell, “Science of Microelectronic Fabrication”, Oxford University Press, 2001.
DISCLAIMER: The appearance of external links on this web site does not constitute endorsement by the School of Biotechnology/Amrita Vishwa Vidyapeetham or the information, products or services contained therein. For other than authorized activities, the Amrita Vishwa Vidyapeetham does not exercise any editorial control over the information you may find at these locations. These links are provided consistent with the stated purpose of this web site.
