Publication Type : Conference Proceedings
Publisher : Institute of Electrical and Electronics Engineers Inc.,
Source : Proceedings of the 2017 IEEE International Conference on Communication and Signal Processing, ICCSP 2017, Institute of Electrical and Electronics Engineers Inc., p.0557-0561 (2018)
ISBN : 9781509038008
Keywords : Biomedical signal processing, Classification technique, Clinical application, Clustering, Electrocardiography, EmFi, Heart, Noninvasive technique, Pathological conditions, Surveys, Wave characteristics, Wavelet denoising
Campus : Coimbatore
School : School of Engineering
Department : Electronics and Communication
Year : 2018
Abstract : Ballistocardiogram (BCG) refers to mechanical activity of the heart. It is a non-invasive technique that provides information on cardiovascular forces. Few studies have demonstrated the correlation that BCG exhibits with the cardiac output and pathological condition of the heart. However there is no clear proof of the relationship between cardiac cycles and BCG wave characteristics. Different BCG acquisition techniques exist, with differing sensor positions that include arm, feet and spine. To use BCG for clinical applications, the differences in the parameter of signals using different methods have to be reduced and a global template as that of Electrocardiogram (ECG) has to be obtained. So there is a need to understand the way BCG is captured and the nature of the signal. In this paper we have focused on the survey of various techniques for acquiring BCG, denoising methods and classification techniques. Recent developments in BCG are discussed along with comparative studies. The purpose of this paper is to investigate the feasibility of BCG in the field of medical diagnosis.
Cite this Research Publication : M. Ganesan, Dr. Lavanya R., and Sumesh, E. P., “A Survey on Ballistocardiogram to study the Mechanical Activity of Heart”, Proceedings of the 2017 IEEE International Conference on Communication and Signal Processing, ICCSP 2017. Institute of Electrical and Electronics Engineers Inc., pp. 0557-0561, 2018.