Back close

Application of substrate as ground for designing 3D on-chip dielectric resonator antenna with improved characteristics

Publication Type : Journal Article

Publisher : Elsevier

Source : AEU - International Journal of Electronics and Communications

Url :

Campus : Coimbatore

School : School of Engineering

Year : 2020

Abstract : This paper presents a simple method to design 3D on-chip antenna with improved gain and efficiency. In the proposed method, without introducing any additional metal-based ground layer, a low resistive Si substrate is used as the ground plane for a monopole fed dielectric resonator antenna (DRA). A cylindrical DRA (CDRA) made-up of Barium Titanate ( = 24) is placed on the top side of the oxide coated Si wafer and is excited under mode with a coaxial probe inserted from the bottom of the substrate using TSV (through silicon via) hole. The proposed on-chip CDRA (OC-CDRA) designed within the foot-print area of /6.12 /6.12 provides the peak radiation gain and efficiency of 1.2 dBi and 87% respectively at its resonating frequency of 3.5 GHz. Also, it shows 14% fractional bandwidth (FBW) with respect to its resonating frequency. Further, the isolation between co- and cross ( ) polarization components along the maximum radiation direction of the two principle planes with = 0 and 90 are obtained as 34 dB and 39 dB respectively. Preparing the dielectric material, the proposed OC-CDRA is fabricated and the experimentally measured results show good agreement with the simulated results.

Cite this Research Publication : Harshavardhan Singh, Sujit K Mandal, Ayan Karmakar; "Application of Substrate as Ground for Designing 3D Onchip Dielectric Resonator Antenna with Improved Characteristics," AEU - International Journal of Electronics and Communications, Vol. 127, 2020, 153435, ISSN 1434-8411, DOI: 10.1016/j.aeue.2020.153435. (SCI: 3.69) (SJR: 0.757)

Admissions Apply Now