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Publication Type : Conference Paper
Publisher : IOP Conference Series: Materials Science and Engineering, Institute of Physics Publishing,
Source : IOP Conference Series: Materials Science and Engineering, Institute of Physics Publishing, Volume 225, Number 1 (2017)
Keywords : Ad hoc networks, Ad-hoc, Disasters, ESTP, Exchange of information, MEOC, Network architecture, Performance analysis, Post-disaster communications, Transport layer protocols, Wi-Fi, Wireless ad hoc networks, Wireless communication network, Wireless local area networks (WLAN), Wireless telecommunication systems
Campus : Bengaluru
School : School of Engineering
Department : Electronics and Communication
Year : 2017
Abstract : Natural and catastrophic disasters can cause damage to the communication system, the damage may be complete or it may be partial. In such areas communication and exchange of information plays a very important role and become difficult to happen in such situations. So, the rescue systems should be installed in those areas for the rescue operations and to take important decisions about how to make a connection from there to the outside world. Wireless communication network architecture should be setup in disaster areas for the communication to happen and to gather information. Wireless ad-hoc network architecture is proposed in this paper with access nodes. These access nodes acts as hotspot for certain area in which they are set up such that the Wi-Fi capable devices get connected to them for communication to happen. If the mobile battery is drained in such situations wireless charging using microwave is shown in this paper. Performance analysis of the communication transport layer protocols is shown and Efficient SCTP (ESTP) algorithm is developed which shows better results in terms of cumulative packet loss. © Published under licence by IOP Publishing Ltd.
Cite this Research Publication : Dr. T. K. Ramesh and Giriraja, C. V., “Efficient SCT Protocol for Post Disaster Communication”, in IOP Conference Series: Materials Science and Engineering, 2017, vol. 225.