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High-performance Edwards curve aggregate signature (HECAS) for nonrepudiation in IoT-based applications built on the blockchain ecosystem

Publication Type : Journal Article

Publisher : Elsevier

Source : Journal of King Saud University - Computer and Information Sciences Volume 34, Issue 10, Part B, November 2022, Pages 9677-9687

Url : https://www.sciencedirect.com/science/article/pii/S1319157821003359

Campus : Coimbatore

School : School of Computing

Year : 2022

Abstract : “Blockchain” is a buzzword that has captured attention from researchers in almost every possible domain. In a blockchain ecosystem, multiple parties across the network have to establish trust in an untrusted environment to ensure seamless nonrepudiation. Nonrepudiation is a crucial factor for secure information auditing in the blockchain. To achieve this, we require an optimal digital signature. In this work, we design a digital signature to address the nonrepudiation challenge in blockchain ecosystems. Our approach developed in the current work completed signing and verification tasks with 10% and 13% shorter processing times, respectively than the conventional digital signature scheme. The adoption of the high-performance Edwards curve aggregate signature (HECAS) in a blockchain ecosystem can yield a 10% improvement in the transaction flow, a 10% improvement in block validation and a 40% decrease in storage costs relative to the same system implemented without HECAS. Finally, we simulated various blockchain-based Internet of Things (IoT) ecosystems and experimented with our scheme. The results show that our work can produce convincing, consistent results across various sensor data types from smart IoT-based blockchain solutions.

Cite this Research Publication : Guruprakash Jayabalasamy, Srinivas Koppu, "High-performance Edwards curve aggregate signature (HECAS) for nonrepudiation in IoT-based applications built on the blockchain ecosystem", Elsevier, Journal of King Saud University - Computer and Information Sciences Volume 34, Issue 10, Part B, November 2022, Pages 9677-9687

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