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Influence of Bath Lifetimes and Electroplating Performance

Publication Type : Conference Paper

Publisher : Meeting Abstracts

Source : Meeting Abstracts, 2007

Url :

Campus : Amritapuri

School : Centre for Cybersecurity Systems and Networks, School of Engineering

Center : Cyber Security, TBI

Department : cyber Security

Year : 2007

Abstract : pWith shrinking metal lines and increased stacking of layers, BEOL processes today show higher dominance in affecting device performance. To maintain high process margin with low cost-of-ownership, a robust Cu process module is essential to any high volume manufacturing environment. Electroplating techniques with sophisticated current amp; voltage application methodologies are commonly used in the presence of electrolytes with widely varying conductivities to produce uniform Cu films. Well known also are the importance of organic additives to plating baths and their influence on the “bottom-up” or “super-filling” of Cu in damascened interconnect structures./p

Cite this Research Publication :
Dr. Krishnashree Achuthan, Wang, Q., Brooks, B., and Sahota, K., “Influence of Bath Lifetimes and Electroplating Performance”, in Meeting Abstracts, 2007

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