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Microstrip patch based high isolation planar crossover for beamforming applications

Publication Type : Conference Paper

Publisher : 2016 IEEE International WIE Conference on Electrical and Computer Engineering (WIECON-ECE),

Source : 2016 IEEE International WIE Conference on Electrical and Computer Engineering (WIECON-ECE), IEEE, Pune, India (2016)

Keywords : array signal processing, Beamforming, beamforming networks, Butler matrix, circular crossover, frequency 2.4 GHz, Hexagonal patch crossover [HPC], Insertion loss, Microstrip, Microstrip antennas, Microstrip crossover, microstrip patch based high isolation planar crossover, Permittivity, planar antennas, Ports (Computers), rectangular crossover, Scattering parameters, Substrates, UHF antennas

Campus : Amritapuri

School : School of Engineering

Center : Amrita Innovation & Research

Department : Electronics and Communication

Verified : Yes

Year : 2016

Abstract : In this paper, a microstrip patch is extended to form planar crossover by suitably choosing the feed locations for orthogonal polarizations. The overlap is modified as a hexagonal patch which offers an isolation of -35 dB at 2.4 GHz. Crossover is a part of butler matrix, which is finds applications in beamforming networks. The proposed crossover is compared for reflection and transmission characteristics and compactness with rectangular and circular crossover at same frequency.

Cite this Research Publication : P. G and Dr. Sreedevi K Menon, “Microstrip patch based high isolation planar crossover for beamforming applications”, in 2016 IEEE International WIE Conference on Electrical and Computer Engineering (WIECON-ECE), Pune, India, 2016.

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