Back close

Pattern matching based sensor identification layer for an android platform

Publication Type : Journal Article

Thematic Areas : Amrita Center for Cybersecurity Systems and Networks

Publisher : Wireless Communications and Mobile Computing

Source : Wireless Communications and Mobile Computing, Volume 2018, Number 4734527, p.11 (2018)

Url : https://www.hindawi.com/journals/wcmc/2018/4734527/

Campus : Amritapuri

School : Centre for Cybersecurity Systems and Networks, School of Engineering

Center : Cyber Security

Department : cyber Security

Year : 2018

Abstract : As sensor-related technologies have been developed, smartphones obtain more information from internal and external sensors. This interaction accelerates the development of applications in the Internet of Things environment. Due to many attributes that may vary the quality of the IoT system, sensor manufacturers provide their own data format and application even if there is a well-defined standard, such as ISO/IEEE 11073 for personal health devices. In this paper, we propose a client-server-based sensor adaptation layer for an Android platform to improve interoperability among nonstandard sensors. Interoperability is an important quality aspect for the IoT that may have a strong impact on the system especially when the sensors are coming from different sources. Here, the server compares profiles that have clues to identify the sensor device with a data packet stream based on a modified Boyer-Moore-Horspool algorithm. Our matching model considers features of the sensor data packet. To verify the operability, we have implemented a prototype of this proposed system. The evaluation results show that the start and end pattern of the data packet are more efficient when the length of the data packet is longer.

Cite this Research Publication : H. Min, Kim, T., Heo, J., Cerny, T., Sankaran, S., Ahmed, B. S., and Jung, J., “Pattern matching based sensor identification layer for an android platform”, Wireless Communications and Mobile Computing, vol. 2018, p. 11, 2018.

Admissions Apply Now