Publication Type : Journal Article
Publisher : Silicon, Springer Netherlands,
Source : Silicon, Springer Netherlands, Volume 11, Issue 1, p.345-354 (2019)
Url : https://www.scopus.com/inward/record.uri?eid=2-s2.0-85045733946&doi=10.1007%2fs12633-018-9848-6&partnerID=40&md5=9111adc8d9376fcde1ffa41bb856d01c
Keywords : Binary alloys, Copper alloys, Copper composites, Dry sliding wear, Experimental investigations, Mechanically mixed layers, Metallic matrix composites, Microstructural analysis, Pin on disc tribometer, scanning electron microscopy, Silicon alloys, Silicon carbide, Stir casting, Surface analysis, Tin alloys, Tribological applications, Tribology, Wear of materials, Wear resistance
Campus : Coimbatore
School : School of Engineering
Department : Mechanical Engineering
Year : 2019
Abstract : The objective is to fabricate Cu-10Sn alloy and its composites reinforced with varying wt% of SiC (5, 10 and 15) to investigate its dry sliding wear behaviour. Microstructural analysis for composites revealed well dispersed SiC particles within matrix except for 15 wt% SiC composite, where agglomeration took place. Amongst all composites and alloy, 10 wt% of SiC composite had better hardness (144 HV). The tribological analysis using Pin-on-Disc tribometer for all alloy and composites revealed increase in wear rate with increase in load and distance for all combinations of parameters (load, sliding distance, and sliding velocity). Worn surface analysis concluded that the wear rate decreased with increase in velocity for both 5 and 10 wt% SiC composite due to formation of Mechanically Mixed Layer. The composite with 10 wt% SiC showed enhanced wear resistance and hence can be used for tribological applications like bearings and bushes. © 2018, Springer Science+Business Media B.V., part of Springer Nature.
Cite this Research Publication : Dr. Radhika N, Karthik, R., Gowtham, S., and Ramkumar, S., “Synthesis of Cu-10Sn/SiC Metal Matrix Composites and Experimental Investigation of its Adhesive Wear Behaviour”, Silicon, vol. 11, no. 1, pp. 345-354, 2019.