Publication Type : Conference Paper
Thematic Areas : Humanitarian-Robotics-HCI
Publisher : TechSym 2010
Source : TechSym 2010 - Proceedings of the 2010 IEEE Students' Technology Symposium, Kharagpur, 2010, pp. 206-210.
Url : http://www.scopus.com/inward/record.url?eid=2-s2.0-77953926465&partnerID=40&md5=39dd49fafb400904536c5dfdc88db902
ISBN : 9781424459742
Keywords : Central component, computer based training, Distance education, End users, Engineering, Engineering education, Haptics, Laboratories, PCB, Polychlorinated biphenyls, Real time, Self-learning, Soldering, Students, Technology, Touch sensitive, Virtual training
Campus : Amritapuri
School : Center for Gender Equality and Women Empowerment, Centre for Cybersecurity Systems and Networks, Department of Social Work, School of Engineering
Center : Ammachi labs, Center for Women’s Empowerment and Gender Equality, Cyber Security
Department : cyber Security, Social Work
Year : 2010
Abstract : Labs form a central component especially in engineering education. The objective of our current work is to enhance the possibility of teaching, learning and experiencing engineering lab targeted towards teachers and students of various disciplines in engineering. This is achieved by developing virtual computer based lab environments. The experience of these environments is enriched with touch based technology. This paper talks about creation of virtual soldering environment. We have successfully implemented a working prototype which would enable the end user to get a feel for real time soldering. This approach of 'virtual' computer based training environment has great potential that stimulates self-learning process of soldering. © 2010 IEEE.
Cite this Research Publication : Ca Venkittarayan, a, J., Gopal, VaMadan, Kartikkumar, Ra, Nitin, B. Sa, Madan, Na, Rajamani, Kb, Dr. Krishnashree Achuthan, Bijlani, Bb, and Rao R. Bhavani, “Virtual soldering environment using touch and gesture for engineering labs education”, in TechSym 2010 - Proceedings of the 2010 IEEE Students' Technology Symposium, Kharagpur, 2010, pp. 206-210.