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A novel Cu-Gr composite electrode development for electric discharge machining of Inconel 718 alloy

Publication Type : Journal Article

Publisher : IOP Science Publication

Source : Surface Topography: Metrology and Properties, IOP Science Publication, Volume 9, No 3, 2021.

Url : https://ui.adsabs.harvard.edu/abs/2021SuTMP...9c5025S/abstract

Campus : Chennai

School : School of Engineering

Department : Mechanical Engineering

Year : 2021

Abstract : Requirement of processes with high productivity leads to the development of new tools and machining technique. One such attempt was made to develop a Copper Composite (CC) tool reinforced with graphite particles through the stir casting route. The CC tool was utilized to machine the Inconel 718 alloy using Electric Discharge Machining (EDM) technique by varying input variables viz tool material, discharge current, pulse on time, pulse off time and gap distance. Brass, Copper, Copper-5% Graphite (CG5), Copper-10% Graphite (CG10), Copper-15% Graphite (CG15) are the various used tool material whereas Material Removal Rate (MRR), Tool Wear Ratio (TWR) and Surface Roughness (Ra) were recorded as responses. The results revealed that using the CG10 and CG15 tools causes arcing and open circuit under some parametric conditions. CG5 offers best MRR and least TWR owing to the bridging effect, high thermal conductivity and lesser density which was suitable for roughing operation whereas brass offers least Ra which was recommended for finishing operation. The surface topography was analyzed with the aid of Scanning Electron Microscope (SEM). Micro crack, pock marks, globules and remelted layers are some of the defects observed in surface morphology. The process parameters was optimized using VIKOR technique.

Cite this Research Publication : C Somu, R Ranjith, P K Giridharan and M Ramu, A Novel Cu-Gr Composite Electrode Development for Electric Discharge Machining of Inconel 718 Alloy, Surface Topography: Metrology and Properties, IOP Science Publication, Volume 9, No 3, 2021.

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