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Real Time Implementation of PI and PID Controlled Cascaded H-Bridge Eleven Level Inverter using SPWM

Publication Type : Journal Article

Source : Informacije MIDEM – Journal of Microelectronics Electronic Components and Materials, Vol.46 (2), pp.65-73, 2016.

Url : https://www.semanticscholar.org/paper/Real-Time-Implementation-of-PI-and-PID-Controlled-Sivagamasundari-Melba/e2e346aa78a8e6e6586bcc6afa7682f2ed2f2e28

Campus : Coimbatore

School : School of Engineering

Department : Electrical and Electronics

Verified : No

Year : 2016

Abstract : Multilevel inverters are nowadays widely used in high-power and high-voltage applications. A multilevel inverter synthesizes a large number of levels to get the desired output voltage levels and they have lot of merits such as improved output waveform, smaller passive filter size, lower Electro Magnetic Interference and reduced harmonics. However, multilevel inverters also have some disadvantages such as increased number of components, voltage-balancing problem and higher switching losses. This paper presents a PI and PID Controlled Cascaded H-bridge eleven level inverter based sinusoidal pulse width modulation control technique suitable for improved power quality applications. The main objective of reducing the THD of output of the chosen eleven level cascaded inverter under set point tracking as well as steady-state with fast transient response are proposed from control point of view. Simulation results have been discussed that the cascaded H-bridge eleven level inverter performs perfectly in connection with PI or PID. A comparative analysis of these two different controllers is revealed. Harmonic spectrum and output voltage and current waveforms have been obtained to validate the role of controllers. Experimental results are presented to confirm the simulation results.

Cite this Research Publication : M.S.Sivagama Sundari & P. Melba Mary, “Real Time Implementation of PI and PID Controlled Cascaded H-Bridge Eleven Level Inverter using SPWM” Informacije MIDEM – Journal of Microelectronics Electronic Components and Materials, Vol.46 (2), pp.65-73, 2016.

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