Publications

Abstract : Thermal power management within the confined structure of modern electronics is of prime importance. Heat dissipation techniques include liquid cooling, air cooling, immersion cooling and lately heat pipes. However, during the utilization of heat pipes in electronics for effective cooling, a quantifiable amount of heat is lost through the heat pipe's adiabatic section. This heat lost might impair the surrounding components. To resolve this complication, phase change material (PCM) is introduced in heat pipes. Experiment is conducted on the effective thermal conductance of heat pipes by establishing their thermal resistance. Temperature distribution profiles are depicted for different power inputs. A brief CFD model for PCM (Paraffin Wax - Tetracosane) is developed; Liquid fraction is extracted for different inputs of power during the charging process. Effective heat captured by PCM for rating of 30–50 W extends from 10 to 15% of the total heat supplied, thereby restricting most of the heat dissipation from reaching the proximity of other components.