Publication Type:



Volume US6462409 B1, Number US 09/876,259 (2002)



A semiconductor wafer polishing method and apparatus therefor are provided having a system housing and a robotic handling system for moving the semiconductor wafer between a belt module and a rotary module for respective linear and rotary polishing. A buff module and a cleaning module are provided in the system housing for buffing and cleaning the semiconductor wafer.

Cite this Research Publication

K. Dr. Achuthan and Woo, C. Mei- Chu, “Semiconductor wafer polishing apparatus”, U.S. Patent US 09/876,2592002.