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Course Detail

Course Name Edge AI on Embedded Platforms
Course Code 25ES634
Program M. Tech. in Robotics and Automation
Credits 3
Campus Amritapuri , Bengaluru

Syllabus

Introduction to Edge AI and Embedded Inference. Overview of Edge AI – definitions, applications, and market trends. Comparison with cloud-based inference. Characteristics of embedded platforms for AI: constraints and design trade-offs. Overview of typical edge AI workflows – data collection, model training, deployment. Introduction to neural network models: CNN, DNN, quantization, pruning, and compression for edge inference. Overview of popular model formats – ONNX, TFLite, and CoreML. Embedded AI Toolchains and Deployment Pipelines. Introduction to hardware accelerators: NPU, DSP, GPU in embedded SoCs. Overview of AI toolchains: NXP eIQ (for i.MX), TI TIDL (for Sitara, Jacinto SoCs), Coral Edge TPU, and NVIDIA Jetson. Model optimization: post-training quantization, compilation, and deployment. Use of ONNX Runtime, TensorFlow Lite, and vendor SDKs. Layer mapping and performance profiling. Deployment flow: preprocessing, inference, and post-processing on the device. Applications, Security, and Performance Evaluation. Application case studies: real-time object detection, smart camera, human presence detection, gesture control, predictive maintenance. Integrating edge AI with peripherals (camera, microphone, sensors). Performance metrics: latency, throughput, power, and memory. Challenges in model accuracy vs efficiency. Introduction to secure model deployment – model integrity, secure boot, and encrypted weights. Future directions: federated learning, Edge-to-Cloud AI, TinyML.

Suggested Lab Sessions:

·         Overview of microcontrollers and embedded systems

·         Implementation of neural networks using edge computing

·         Implement AI toolchains for model conversion, optimization and deployment

·         Implement security and integration aspects for AI-enabled embedded systems.

Objectives and Outcomes

Course Outcomes:

CO1: Understand the architecture and design trade-offs of Edge AI systems.

CO2: Apply embedded AI toolchains for model conversion, optimization, and deployment.

CO3: Analyse AI model performance metrics in embedded contexts.

CO4: Evaluate security and integration aspects of AI-enabled embedded systems.

Text Books / References

Textbooks / References:

1.      G. M. Iodice, TinyML Cookbook – Second Edition. Birmingham, UK: Packt Publishing, Nov. 2023.

2.      S. Guo and Q. Zhou, Machine Learning on Commodity Tiny Devices. CRC Press, Oct. 2022.

3.      D. A. Patterson and J. L. Hennessy, Computer Organization and Design: RISC-V Edition – The Hardware Software Interface, 2nd ed. Burlington, MA, USA: Morgan Kaufmann, 2021.

4.      Texas Instruments, “TIDL (TI Deep Learning) User Guide,” [Online]. Available: https://www.ti.com/tool/TIDL.

5.      NXP Semiconductors, “eIQ Machine Learning Software Development Environment,” [Online]. Available: https://www.nxp.com/eiq.

6.      IEEE Standards Association, IEEE P2805: Standard for Functional Requirements for AI Edge Devices (Draft), IEEE, 2023.

7.      P. Pareek, S. Mishra, M. J. C. S. Reis, and N. Gupta, Cognitive Computing and Cyber Physical Systems. Cham, Switzerland: Springer, Feb. 2025.

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