Syllabus
Unit 1:
Basics of Semiconductor – Intrinsic and Extrinsic Semiconductors, Equilibrium in absence and presence of Electric Field, Non-Equilibrium and Quasi-Fermi Levels, Charge Density. Electric Field, Potential, Poisson’s Equation, Transit Time, Drift and Diffusion current, Contact Potentials, The pn Junction. Overview of the MOS Transistor – Structure, Operation and Characteristics of MOS Transistor. The Two-Terminal MOS Structures – Flatband Voltage, Potential Balance and Charge Balance, Effect of Gate-Body Voltage on Surface Condition, Accumulation and Depletion, Inversion, Small-Signal Capacitance.
Unit 2:
The Three-Terminal MOS Structure – Contacting the Inversion Layer, The Body Effect, Regions of Inversion, A “VCB Control” Point of View, Uses for Three-Terminal MOS Structures.
The Four-Terminal MOS Transistor – Transistor Regions of Operation, Complete All-Region Model, Simplified All-Region Models, Models Based on Quasi-Fermi Potentials, Regions of Inversion in Terms of Terminal Voltages, Strong Inversion, Weak Inversion, Moderate-Inversion and Single-Piece Models, Source-Referenced vs. Body-Referenced Modeling, Effective Mobility, Effect of Extrinsic Source and Drain Series Resistances, Temperature Effects, Breakdown, The p-Channel MOS Transistor, Enhancement-Mode and Depletion-Mode Transistors, Model Parameter Values, Model Accuracy, and Model Comparison.
Unit 3:
Small-Dimension Effects – Carrier Velocity Saturation, Channel Length Modulation, Charge Sharing, Drain-Induced Barrier Lowering, Punchthrough, Combining Several Small-Dimension Effects into One Model, Hot Carrier Effects and Impact Ionization, Velocity Overshoot and Ballistic Operation, Polysilicon Depletion, Quantum Mechanical Effects, DC Gate Current, Junction Leakage, Band-to-Band Tunneling and GIDL, Leakage Currents—Particular Cases, The Quest for Ever-Smaller Devices.
Large-Signal Modeling of MOS Transistor – Quasi-Static Operation, Terminal Currents in Quasi-Static Operation, Evaluation of Intrinsic Charges in Quasi-Static Operation, Transit Time under DC Conditions, Limitations of the Quasi-Static Model, Non-Quasi-Static Modeling, Extrinsic Parasitics.
Overview of Modern Semiconductor Devices – SOI MOSFETs, Multi-gate Gate FETs like -Double Gate, FinFET, Gate All Around FETs (GAA-FETs).
Course Outcomes
At the end of the course, the student should be able to
- CO1: Explain the physical behavior of intrinsic and extrinsic semiconductors, pn junctions, and MOS structures under various biasing conditions.
- CO2: Analyze the characteristics of two- and three-terminal MOS devices and interpret the effects of gate voltage on device behavior.
- CO3: Model four-terminal MOS transistors considering different regions of operation, mobility variations, and temperature effects.
- CO4: Evaluate short-channel effects and develop models for scaled MOS devices, with an overview of advanced structures including SOI, Double Gate, FinFET, and GAA-FETs.
Skills Acquired: Ability to model and analyze semiconductor devices using physical principles and apply advanced MOSFET models for modern nano-scale device design and simulation.
CO-PO Mapping:
| CO/PO |
PO1 |
PO2 |
PO3 |
PSO1 |
PSO2 |
PSO3 |
| CO 1 |
– |
– |
– |
3 |
– |
– |
| CO 2 |
– |
– |
– |
3 |
2 |
– |
| CO 3 |
– |
– |
– |
3 |
3 |
2 |
| CO 4 |
– |
– |
– |
3 |
3 |
2 |