Course

Unit I

Definition of MEMS. MEMS devices. Silicon as a MEMS material – mechanical properties of silicon. Mechanical components in MEMS. Design concepts of mechanical components.

Working Principles of Microsystems. Engineering Science for Microsystems design and Fabrication. Scaling laws – Scaling in geometry, rigid body dynamics, electrostatic forces, electromagnetic forces, electricity-fluid mechanics and heat transfer.

Unit II

Materials for MEMS and Microsystems. Fabrication technologies – Photolithography – Ion implantation – diffusion – oxidation – CVD – Physical Vapor Deposition – Etching. Micro manufacturing – Bulk and surface micro machining – LIGA.

Unit III

Microsystems Design – Design considerations – Process design – Mechanical Design – CAD – Micro system packaging – Levels – Bonding – Interfaces – Assembly – Selection of Packaging Materials.

Learning Objectives

LO1    To gain basic knowledge on overview of Microelectromechanical System and various
Fabrication Techniques

LO2    To familiarize with the operation principles of selected MEMS Sensors and Actuators

LO3    To develop interdisciplinary skills towards higher learning and research

Course Outcomes

CO1    Able to understand the world of microelectromechanical devices and systems
CO2    Able to gain fundamental knowledge on material properties & fabrication
technologies

CO3    Able to comprehend working principles of sensing and actuation.
CO4    Able to design micro devices, micro systems using the MEMS fabrication process

CO-PO Mapping

Textbook

1. Tai–Ran Hsu – ‘Mems & Microsystems Design and Manufacturing’ – John Wiley & Sons – 2008 – 2nd Edition References

References:

1. Chang Liu, “Foundations of MEMS”, Pearson International Edition,
2. Gaberiel Rebiz, “RF MEMS Theory, Design and Technology”, John Wiley &

Sons,2003