Syllabus
Unit 1:
Introduction to MEMS Technology, Historical perspective and evolution, Design considerations and constraints, Scaling laws and miniaturization challenges, Materials for MEMS applications and their properties– Silicon, glass, polymers and metals, Bulk and Surface Micro-machining techniques. Etching, Deposition (CVD/PECVD), Evaporative Sputtering, Electroplating, Electroless-plating.
Unit 2:
Photolithography, Advanced lithography techniques, Wet and Dry Etching Methods, Isotropic Etching and Anisotropic Etching, Wafer-Bonding, Packaging, High Aspect-Ratio Processes (LIGA) Techniques, Characterisation techniques – Electrical, mechanical characterization
Unit 3 :
MEMS Pressure, Accelerometers and Flow sensors, Electrostatic sensing and actuation principles, thermal sensing and actuation principles, Piezoresistive/Piezoelectric sensing principles, Optical sensing and actuation, BioMEMS – Lab-on-a-chip systems, Wearable systems for health monitoring, bio-compatible materials.
Objectives and Outcomes
Course Objectives
- To impart knowledge on microfabrication techniques for MEMS applications.
- To familiarise with the operation principles of selected MEMS Sensors and Actuators
- To introduce interdisciplinary understanding of engineering and materials science in MEMS development.
Course Outcomes: At the end of the course, the student should be able to
- CO1: able to understand the world of microelectromechanical devices and systems
- CO2: able to gain fundamental knowledge on material properties and fabrication technologies
- CO3: able to comprehend working principles of sensing and actuation
- CO4: able to design micro-devices using the MEMS fabrication process
Skills Acquired: Application of microfabrication and design for MEMS sensors and actuators.
CO-PO Mapping:
CO/PO |
PO 1 |
PO 2 |
PO 3 |
PSO1 |
PSO2 |
PSO3 |
CO 1 |
– |
– |
|
2 |
2 |
2 |
CO 2 |
– |
– |
|
3 |
3 |
2 |
CO 3 |
– |
– |
|
2 |
3 |
2 |
CO 4 |
– |
– |
|
3 |
3 |
3 |