Course

Unit 1:

General Packaging Principles –Wire Bonding – Flip Chip Technologies –Types of Packaging
– Ball Grid Array – Quad Lead – Surface Mount Technology –Monolithic 3D ICs.

Unit 2:

Component Packaging (Including Integrated Circuits, Opto, MEMS, RF and Solar Devices) – Substrates used in Packaging –Electrical and Thermal Considerations.

Unit 3:

Reliability Test Strategies –Reliability Modelling –Reliability Testing, Degradation and Failure Mechanisms – MTTF, FIT, Thermal – Chemical – Electrical and Mechanical – Characterization Techniques.

Course Objectives

• To introduce basic concepts and types in Microchip Packaging
• To understand how packaging needs vary for various applications.
• To understand the thermal, mechanical, electrical, and chemical degradation mechanisms that affect the reliability of packaged devices. 

Course Outcomes: At the end of the course, the student should be able to

• CO1: Understand various IC packaging techniques.
• CO2: Understand constraints in each technique and modifications needed in extending these to various applications.
• CO3: Understand various reliability test strategies used in packaging.
• CO4: Understand the reliability issues in packaging

Skills Acquired: Provide an in-depth knowledge on how an IC package is done.

CO-PO Mapping:

1. Vasilis F. Pavlidis, IoannisSavidis and Eby G. Friedman, Three dimensional Integrated Circuit Design Second Edition., Morgan Kaufmann, 2017.

1. Milton Ohring and Lucian Kasprzak, Reliability and Failure of Electronic Materials and Devices, Second Edition, Academic Press, 2014.
2. Chuan Seng Tan, Kuan-Neng Chen and Steven J Koester, 3D integration for VLSI Systems, Pan Stanford Publishing, CRC Press, 2012.
3. Andrea Chen and Randy Hsiao-Yu Lo, Semiconductor Packaging: Materials Interaction and Reliability, CRC Press, 2012.
4. Richard K. Ulrich and William D. Brown, Advanced Electronic Packaging, John Wiley & Sons, Inc., 2006.