Publication Type:

Conference Paper

Source:

MOOC Innovation and Technology in Education (MITE), 2013 IEEE International Conference in, p.219-223 (2013)

Keywords:

Conferences, design engineering, Detectors, Educational institutions, further education, Humanitarian Technologies lab, industrial product development cycle, MATLAB, Microcontrollers, Monitoring, oximeter, Oximetry, Ports (Computers), problem solving ability, Product development, pulse oximeter design, technical skills enhancement, UG research, UG research experiences, undergraduate research experience

Abstract:

All undergraduates (UG) who set aside research for faculties and professionals are not only missing interesting moments in their graduation, but also fail to grab the extra bit of information which will assist them in their career. Formal education is an integral part of learning but research experience gives hands on experience which class room coaching fail to deliver. These activities not only enhance technical skills but also develop vital life skills like team work, communication skills and problem solving ability. The style of project submission and reviewing gives the student an overview on industrial product development cycle. A Humanitarian Technologies lab established in our institution gave us ample opportunity to work with projects which benefit human life. In this paper we present the research work we carried out in pulse oximeter design and implementation, and thereby bring out the UG research experiences - benefits, challenges, knowledge developed, expertise acquired etc.

Notes:

cited By 0; Conference of 2013 IEEE International Conference in MOOC, Innovation and Technology in Education, MITE 2013 ; Conference Date: 20 December 2013 Through 22 December 2013; Conference Code:103477

Cite this Research Publication

R. K. Megalingam, Sivaprasad, S., Anoop, M., Prabhu, A., Sreekanthan, K., and Baburaj, A., “First undergraduate research experience: Pulse oximeter design”, in MOOC Innovation and Technology in Education (MITE), 2013 IEEE International Conference in, 2013, pp. 219-223.