Back close

Influence of Organic Additive Benzene Sulfonic Acid on the Magnetic Behavior of Electrodeposited COMNP Thin Film Alloys

Publication Type : Journal Article

Source : International Journal of Innovative Technology and Exploring Engineering (IJITEE), Volume-8, Issue-10S, August 2019. DOI: 10.35940/ijitee.J1047.08810S19

Url : https://www.ijitee.org/wp-content/uploads/papers/v8i10S/J104708810S19.pdf

Campus : Kochi

School : School of Arts and Sciences

Year : 2019

Abstract : CoMnP alloy films were synthesized by Electrodeposition Technique. The Electrochemical deposition technique is especially interesting due to its low cost and high quality of deposit. Thin Magnetic films are extensively used in various electronic devices including high density recording media and micro electromechanical systems (MEMS). Electrodeposition being cost effective, in the present work cobalt based magnetic films was deposited electrochemically and characteristics features of the deposited film were studied. Effect of organic additives Benzene sulfonic acid in the presence of the sodium hypophosphite was studied. Structural and magnetic properties were investigated and reported. The hysteresis loops of the CoMnP alloy films were measured and studied. The result shows that organic additive Benzene sulfonic acid has altered the magnetic properties of the films. Among the different compositions, CoMnP compound exhibit good hard magnetic properties, Under the best condition involving addition of 0.2M of NaH2PO2 and 4 gL-1 of Benzene Sulfonic Acid at a current density of 7 mA-cm-2 and time of deposition 60 minutes, the thickness of the film was found to be 3.5 micrometer with coercivity 1410 Oe and remanent 0.12 emu.The reason for the change in magnetic properties and structural characteristics because of the additive were discussed.

Cite this Research Publication : M. RM. Krishnappa and K. V. Kannan Nithin, "Influence of Organic Additive Benzene Sulfonic Acid on the Magnetic Behavior of Electrodeposited COMNP Thin Film Alloys," International Journal of Innovative Technology and Exploring Engineering (IJITEE), Volume-8, Issue-10S, August 2019. DOI: 10.35940/ijitee.J1047.08810S19

Admissions Apply Now